News & Events

News & Events

WORLDWIDE 2017/02/06

Taisys to showcase innovation at Mobile World Congress 2017

Taisys Technologies, a world-leading solutions provider to enable value-added services securely on the mobile device, will be showcasing latest products and platforms at Mobile World Congress (MWC) 2017. MWC is the largest annual mobile industry exhibition and conference and will be held from Feb. 27th – Mar. 2nd in Barcelona, Spain.

Taisys will be presenting its slimduet® platform– MNO’s silent roamer solution at the MWC. slimduet® platform is a MNO-centric, digitised management and distribution hub for prepaid services. The slimduet® downloading engine is at the heart of this solution, and allows SIM profiles to be downloaded onto all forms of SIM cards: regular SIMs issued by MNOs, thin SIMs, and embedded SIMs (eSIM). The platform aims to create an ecosystem to allow MNOs to cross-sell services from each other and eliminate national boundaries.

For the past two years, Taisys launched B2C pilot of slimduet® service, partnering with key industry players China Mobile, Hutchison, Chunghwa Telecom, StarHub, Indosat Ooredoo, and many more. Now that the concept has been proven and with major projects launching this year, we are fully engaging MNOs to adopt slimduet® platform as their silent roamer solution,” said Taisys Chairman, Jason Ho. “The MWC is the perfect place to introduce slimduet® platform to MNOs that are searching for a solution to end the silent roamer dilemma.”

This will be Taisys’ sixth consecutive participation in the MWC, and will continue to bring complete solutions that enable partners and new players in securely deploying their services on the mobile device that reduce costs, create new revenue streams, and expand customer base. Aside from the slimduet® platform, Taisys will also present mobile banking solution, duoSIM® product to reduce cost for replacing legacy SIM through post-issuance service, SIMoME® Java for self-development for non-telecom industry, and slimduet® Pocket WiFi.

Taisys invites attendees to visit us at the Mobile World Congress 2017. This year Taisys will be hosting meeting rooms for a more private and intimate dialogue with clients.

To book an appointment:

Jennifer Chang

Taisys Technologies

+886 2 2627 0927 #6009

To download slimduet® platform white paper:

SLIMDUET® PLATFORM  white paper link

For more information on Mobile World Congress, visit

About Taisys

Taisys Technologies Co., Ltd. is a world leader in providing mobile inter-connectivity and vertical integration solutions which enable telecom, financial industries and government organizations to extend innovative mobile services in a secure and convenient manner.

Taisys’ slimduet® platform is the world’s first live ecosystem of consumer eSIM technology, enabling MNOs to capture revenue of the silent roamer market. Furthermore, MNOs worldwide are adopting this platform to leverage its digitalized distribution network.

Taisys has R&D centers in Taipei, Beijing, Chongqing and India, with regional offices located in Taiwan, China, Hong Kong, Singapore, India, South Africa, Kenya, Honduras and Spain.